2020-2021 Undergraduate Academic Catalog 
    May 20, 2022  
2020-2021 Undergraduate Academic Catalog [ARCHIVED CATALOG]

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CE 4100 - Embedded System Fabrication

2 lecture hours 2 lab hours 3 credits
Course Description
This course focuses on practical aspects of turning a laboratory prototype into a reliable production prototype. Lecture topics will follow a microprocessor-based embedded system design through the addition of support circuitry, production component selection, printed circuit board layout, and 3D design and printing of enclosures. Lab exercises will put these topics into practice as students will complete the design activities and assemble prototypes. (prereq: (CE 2812  or BE 3205  or EE 2920  and (EE 2060  or EE 2725 ))
Course Learning Outcomes
Upon successful completion of this course, the student will be able to:
  • Identify support circuitry necessary for simple embedded systems
  • Assess issues that arise when interfacing peripherals to a microcontroller
  • Describe criteria for component selection
  • Summarize relevant electromagnetic compatibility issues related to a given circuit 
  • Explain considerations for printed circuit board layout
  • Create a printed circuit board layout starting with schematic capture
  • Prepare circuit board design for fabrication
  • Complete assembly of printed circuit board including surface mount components
  • Explain processes for board bring-up and firmware programming in a manufacturing environment
  • Design an enclosure for an embedded system in 3D modeling software
  • Utilize rapid prototyping techniques to create an electronics enclosure

Prerequisites by Topic
  • Basic embedded system design and programming
  • Basic circuit elements
  • Circuit analysis techniques

Course Topics
  • Embedded system design considerations
  • Schematic capture concepts - symbols, packages, devices
  • Electronic component selection considerations - manufacturer, vendor, availability, package, cost
  • Interfacing to peripherals
  • Printed circuit board (PCB) considerations - layers, trace width and thickness, vias, clearance, mounting holes
  • Electromagnetic compatibility - regulations, design accommodations
  • Surface mount components - selection, assembly techniques
  • Selection of connectors, switches and indicators
  • Generation of files necessary for PCB fabrication and order process
  • 3D modeling techniques
  • 3D printing technologies and workflow
  • Board bring-up and programming firmware

Laboratory Topics
  • Install and become familiarized with electronic design automation (EDA) software
  • Create custom component within EDA software
  • Complete schematic capture for given project within EDA software
  • Complete printed circuit board (PCB) layout within EDA software
  • Generate PCB fabrication files and order PCB from vendor
  • Introduction to 3D modeling and workflow to produce a 3D-printed object
  • Design an enclosure for given project in 3D modeling software
  • Assemble PCB, test and install firmware
  • Assemble complete project in 3D-printed enclosure

Dr. Darrin Rothe

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